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3D Solder
paste inspection
Solder paste deposits are 3D scanned with various vision products,
using the principle of laser triangulation. Every frame acquired by the camera generates one 3D-profile of the
scene.
Adding all the profiles acquired generates a full 3D view of the
circuit board. From image analysis point of view, the 3D images can be processed in
the same way as 2D images. Comparing 2D and 3D image data, the contrast information in every
pixel of a 2D image is replaced with a height value in a 3D image.
Click for Vision
Questionnaire.
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