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3D Solder paste inspection

Solder paste deposits are 3D scanned with various vision products, using the principle of laser triangulation. Every frame acquired by the camera generates one 3D-profile of the scene.

Adding all the profiles acquired generates a full 3D view of the circuit board. From image analysis point of view, the 3D images can be processed in the same way as 2D images. Comparing 2D and 3D image data, the contrast information in every pixel of a 2D image is replaced with a height value in a 3D image.

Click for Vision Questionnaire.


Other Uses

  • Checking the position of wafers in a rack

  • Measuring the stop position of a wafer transfer arm

  • Inspecting missing balls of BGA

  • Detecting the presence or absence of defective marks on an IC

  • Various inspections of ICs

  • Differentiating the direction of chips

  • Detecting the misalignment of insert molding targets

  • Inspecting co-polarity

  • Inspecting liquid crystal segments

  • Inspecting lithium-ion batteries

  • Differentiating a variety of motor coils

  • Differentiating the orientation of rotary switches

  • Checking the lighting status of various lamps on a panel

  • Checking the assembly accuracy of a door

  • Differentiating a wide variety of cylinder blocks

  • Detecting an application gap in sealing material

  • Detecting the presence or absence of chips

  • Measuring the notch position of a gear

  • Inspecting flaws on a steel plate

  • Detecting defective plating on terminal posts

  • Checking for contaminants in a food tray

  • Checking the print on an aluminum package

  • Detecting the curled lid of a chemical container

  • Checking the presence/absence of package insert, shortage of products

  • Detecting molding residue in a mold

  • Detecting the notch position of packing material

  • Measuring the width of sheet material

  • Detecting stains, dirt, and pinholes

  • Gathering data during fluids of the charging

  • Measuring the deformation volume in a load intensity test

  • Measuring the position of blades in wind tunnel experiments

  • Measuring the three-dimensional position of a multi-spindle robotic arm
     

3D Inspection and Laser Vision
CCD Cameras and Profile Devices
  • Metal and Steel Industries

  • Food and Chemical

  • Industries

  • Plastic and

  • Paper Industries

  • Research Institutes

  • Semiconductor Industry

  • Electronic Components

  • Industry

  • Electrical Machinery and

  • Precision Industries

  • Transportation Industry

 

 


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Specifications are subject to change. IDS is not responsible for discrepancies or errors due to typographic errors.
Integrated Dispensing Solutions ● 5311 Derry Avenue ● Building D Agoura Hills CA 91301 ● Ph (818) 597-4300 ● Fax (818) 597-4301